october 2010 doc id 17053 rev 2 1/7 7 EMIF03-SIM04F3 3-line ipad?, emi filter including esd protection features emi symmetrical (i/o) low-pass filter high efficiency in emi/esd protection lead-free package very thin package high reliability offered by monolithic integration high reduction of parasitic elements through integration and wafer level packaging complies with the following standards iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) iec 61000-4-2 level 1: ? 2 kv (air discharge) ? 2 kv (contact discharge) applications where emi filtering in es d sensitive equipment is required: mobile phones and communication systems computers, printers and mcu boards description the EMIF03-SIM04F3 flip chip is a low capacitance emi filter designed to suppress emi/rfi noise in all systems subjected to electromagnetic interference. this filter includes esd protection circuitry, which prevents damage to the protected device when subjected to esd surges up to 15 kv. figure 1. pin configuration (bump side) figure 2. configuration tm : ipad is a trademark of stmicroelectronics. lead-free flip-chip package (11 bumps) 1 2 3 a d c b 47 b1 c1 100 r1 r2 r3 a1 100 a2 gnd c2 gnd a3 b3 c3 d1 d3 d2 a2 and c2 bumps must be connected together on the pcb www.st.com
electrical characteristics EMIF03-SIM04F3 2/7 doc id 17053 rev 2 1 electrical characteristics figure 3. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp internal pins (a1, b1, c1): esd discharge iec 61000-4-2, level 1, air discharge esd discharge iec 61000-4-2, level 1, contact discharge external pins (a3, b3, c3, d1, d2 and d3): esd discharge iec 61000-4-2, level 4, air discharge esd discharge iec 61000-4-2, level 4, contact discharge 2 2 15 15 kv p d line resistance power dissipation at 70 c 60 mw t op operating temperature range - 40 to + 85 c t stg storage temperature range - 55 to 150 c table 2. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 6 v i rm v rm = 3 v per line 50 200 na r 1, r 3 tolerance 20% 80 100 120 r 2 tolerance 20% 37.6 47 56.4 c line v line = 0 v, v osc = 30 mv, f = 1 mhz (measured under zero light conditions) (1) 1. a2 and c2 bumps must be connected together on the printed circuit board 81012pf symbol parameter v = breakdown voltage i = leakage current @ v r = series resistance between input and output c = line capacitance br rm rm i/o line i v v br v rm i r i rm i rm i r v rm v br
EMIF03-SIM04F3 electrical characteristics doc id 17053 rev 2 3/7 figure 8. digital crosstalk measurement figure 4. s21 (db) attenuation measurement b3 - b1 figure 5. s21 (db) analog crosstalk measurements c3 - a1 100.0k 1.0m 10.0m 100.0m 1.0g -50.00 -40.00 -30.00 -20.00 - 1.0g - - - - - - - - - 10.00 - 0.00 f (hz) s21 (db) 100.0k 10.0m 100.0m 1.0g 100.00 -80.00 -60.00 -40.00 -20.00 - - - - - 0.00 1.0m s21 (db) f (hz) figure 6. esd response to iec 61000-4-2 (+15 kv air discharge) on one line figure 7. esd response to iec 61000-4-2 (-15 kv air discharge) on one line in out c3 c2 20 v/div 10 v/div 100 ns/div 100 ns/div c3 c2 in out 10 v/div 10 v/div 100 ns/div 100 ns/div in out c3 c2 1 v/div 500 mv/div 20 ns/div 20 ns/div
ordering information scheme EMIF03-SIM04F3 4/7 doc id 17053 rev 2 2 ordering information scheme figure 9. ordering information scheme emif yy - xxx zz fx emi filter number of lines information package x = resistance value (ohms) z = capacitance value / 10(pf) or 3 letters = application 2 digits = version f = flip chip x = 3: lead-free, pitch = 400 m
EMIF03-SIM04F3 package information doc id 17053 rev 2 5/7 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. package dimensions figure 13. flip-chip tape and reel specification figure 11. footprint figure 12. marking 1.54 mm 30 m 1.14 mm 30 m 400 m 30 255 m 40 400 m 30 605 m 55 170 m 170 m 220 m recommended 220 m recommended 260 m maximum solder stencil opening: copper pad diameter: solder mask opening: 300 m minimum x y x w z w dot, st logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) ecopack ? grade user direction of unreeling all dimensions in mm 4.0 0.1 2.0 0.05 8.0 0.3 1.75 0.1 3.5 - 0.1 ? 1.5 0.1 0.69 0.05 1.31 st xxz yww e 1.68 xxz yww e st xxz yww e xxz yww e st xxz yww e 4.0 0.1 dot identifying pin a1 location
ordering information EMIF03-SIM04F3 6/7 doc id 17053 rev 2 4 ordering information table 3. ordering information note: more information is availa ble in the application notes: an2348: ?stmicroelectronics 400 micro-metre flip chip: package description and recommendation for use? an1751: ?emi filters: recommendations and measurements? 5 revision history table 4. document revision history order code marking package weight base qty delivery mode EMIF03-SIM04F3 ji flip chip 1.74 mg 5000 tape and reel 7? date revision changes 03-may-2010 1 initial release. 12-oct-2010 2 updated value i rm in table 2.
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